Polyimide Film thermal insulator pad is synthesized by the polycondensation of aromatic dianhydride and aromatic diamine (PMDA and ODA ). It shows outstanding physical , thermal, electrical, and chemical properties over a wide range of temperature as low as -452F(-269C) and as high as 500F(+260C).It also offers good dimensional stability and can be die-cut, laminated, metallized, formed, thermoformed or adhesive coated.

Polyimide Film Applications

Flexible printed circuits board(F-PCB)

Motor, wire and cable insulation

Bar code label

Bonding tape

Polyimide Film Specifications

Density : 1.42+/-0.02 g/cm3

Tensile Strength : 135 MPa (MD), 115 MPa (TD)

Elongation : 35 %

Shrinkage : 1.0 % (150°C), 3.0 % (400C)

Breakdown Strength : 150 MV/m (50HZ)

Surface Resistivity : 1.0x10e13 Ω (200C)

Volume Resistivity : 1.0x10e10 Ω (200C)

Dielectric Constant : 3.5+/-0.4 (50HZ)

Loss Tangent : 4.0x10e-3 (48~62HZ)