Gold OSP 0.2mm thickness PCB seamless splicing
Product description
Gold OSP 0.2mm thickness PCB seamless splicing
Multilayer PCB, seamless splicing PCB
1) Thickness: 0.1mm-5mm
2) Minimum linewidth:0.075mm/3mil
3) Minimum gap:0.065/2.8mil
4) Minimum aperture inradium:0.15mm
5) Minimum aperture external diameter:0.45mm
6) Minimum BGA: 0.2mm
7) Layer:4 layers through hole non-impedance
All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
Import / export
1.00 Piece
Free On Board
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