회사 소개
설명
We perform the following engineering services:
Wafer Saw, Laser Symbollization, IC Bonding, IC repackaging, Cross Sectioning, MCM Assembly, BGA Reball
We have developed significant IP to support the repackaging of high pin count integrated circuits and integrated circuits utilizing wafer chip scale packaging.
비즈니스 데이터
사용할 수 없음
사용할 수 없음
5 ~ 10명
2005